Harpak-ULMA today introduced the ULMA VTC 840 WD Washdown Vertical Packaging System, a next-generation vertical ...

PAC Machinery, a leader in flexible packaging equipment and materials, in collaboration with CMES Robotics USA and FANUC, will showcase a fully integrated automated bagging solution featuring ...

Mondi and online car parts marketplace Ovoko have worked together to redesign the packaging for shipping car bumpers, ...

Chevron Corporation (NYSE:CVX) overview covering Dow Jones Industrial Average membership, integrated energy operations, ...

Neil Fryer, global head of aftermarket for PHINIA, discusses that as counterfeit parts become harder to detect, protecting ...

Kalina will oversee the sales strategy across distribution, direct sales, and ProMach brand partnerships as Orion continues ...

CBIC Notification 27/2026-Customs amends Notification 25/2002 to revise the list of goods eligible for BCD exemption for lithium ion cell ...

The finance ministry has issued three separate notifications giving effect to the basic customs duty waiver on goods used in ...

Nexperia has expanded its wide-bandgap portfolio with 1200 V silicon carbide (SiC) MOSFETs in QDPAK packaging, introducing ...

On June 29, Cantor Fitzgerald raised its price target on Teradyne, Inc. (NASDAQ:TER) to $550 from $400. The firm maintained ...

Graphco's Fold Stream Extended Folder and Gluer earned a Pinnacle Award for compact, high-value packaging and inline finishing innovation.

Soaring AI/HPC device demand is driving leading-edge foundries to support the transition from wafers to panels to accommodate increasingly larger device sizes. But to ensure that panels with multiple ...