Abstract: This paper presents a compact PIN-diode-based single-pole double-throw (SPDT) switch for wideband RF systems. The series-shunt topology is adopted for the proposed switch. Compensating ...
Abstract: Through-silicon via (TSV), responsible for inter-layer communication in high-bandwidth memory (HBM), plays a critical role in HBM operation. Therefore, faults occur in TSVs can critically ...
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