By Pietro Antonio Ciclese, Senior Technical Marketing Engineer, Ambarella The workloads that generate the most commercial ...

Qualcomm's data center entry analyzed: how the Modular acquisition, HBC memory architecture, and Arm-based C1000 CPU ...

The company, along with others, is pursuing a new paradigm for cramming more transistors on chips—building up.

IBM just unveiled the world's first sub 1-nanometer chip: 100 billion transistors. IBM also says they've produced functioning ...

Advanced chip packaging, which boosts computing power for artificial intelligence, has made the United States more reliant on ...

USB-C and its Thunderbolt variant are the most up-to-date standards of the USB connector. They allow data-transfer speeds of up to 80Gbps, can fast-charge devices up to 240W, and conveniently fit in a ...

AI scalability will require full-stack co-optimization, not just bigger data centers. AI workloads require a 10X compute efficiency gain over 10 years, making collaboration across algorithms, ...