Abstract: The die-attach layer is a vulnerable structure that is important to the reliability of an insulated-gate bipolar transistor (IGBT) module. A new failure mechanism named fatigue crack network ...
Abstract: Low-profile double-side cooled power modules are emerging in electric-drive inverters to achieve higher power density and efficiency. However, the rigid interconnection between the devices ...
A campaign active since last November has been targeting Python developers building Telegram bots with trojanized Pyrogram ...
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