Semiconductor Engineering

Observability Is A Missing Layer In AI-Era Chiplet Design

In next-generation silicon, AI can interpret system behavior at scale, but only if observability is designed into the fabric ...
Tech Xplore

LiDAR approach could change factory inspections for tiny hard-to-reach parts

Researchers have developed a new LiDAR approach that makes it possible to image small objects with much greater precision and ...
Tech Xplore

Smart clothing for blind travelers

Researchers have developed a prototype of intelligent, or "smart," clothing designed to improve the safety of blind and ...
The Robot Report

Sonair ADAR One 3D ultrasonic sensor is now safety-certified

Sonair says ADAR One was assessed as a human detection sensor according to the IEC 61496 standard for electrosensitive ...
IEEE

Source Localization via Doppler Shifts Using Mobile Sensors in ICNets Within Industry 5.0

Abstract: Source localization plays a significant role in industrial 5.0 applications by availing of the communication networks. For the industrial communication networks (ICNets), Doppler shifts can ...
IEEE

A Back-Illuminated 10 μm-Pitch SPAD Depth Sensor with 42.5% PDE at 940 nm using an Optimized Doping Design

Abstract: We present a novel single-photon avalanche diode (SPAD) pixel array designed for accurate distance measurement with a high photon detection efficiency (PDE). This study was conducted with a ...
Electropages

Analogue output portfolio expanded for functional test and HIL

Pickering Interfaces has released three new PXI/PXIe analogue output modules, expanding its signal sourcing and sensor simulation portfolio for functional test and HIL applications. The new modules ...